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High Precision Stamping TinPlate EMI Shielding Box, RF Shield Can, Mumetal Shielding Case for PCB

High Precision Stamping TinPlate EMI Shielding Box, RF Shield Can, Mumetal Shielding Case for PCB
Product name : High Precision Stamping TinPlate EMI Shielding Box, RF Shield Can, Mumetal Shielding Case for PCB
Item : Shielding Cover-290
Details :

Board Level Shielding

Specified by engineers around the world,Hexin's standard and custom board level shielding (BLS) offers unlimited design flexibility for surface-mount and through-hole configurations. With an array of standard shields that can be customized to any performance requirement,Hexin specializes in today's most challenging EMI/RFI shielding applications. BLS shielding can also be custom-engineered from start to finish based on your specific need.
Material:
 nickle silver,stainless steel,alumin,tin plated
Packing: shield frame in tape and reel,shield cover in common tray
Delivery time: 20 days for tooling,10 days for mass production
Type: two-pieces,single piece,Low profile,Multi-planar,Multi-cavity,Customized
Process: high speed stamping machine,automatic production line and T&R packing
Applaction:monitoring devices,medical devices,communication devices,any device with a circuit board
Manufacturing Capabilities:Prototype,Short-Run

Approval And Testing

●  Material Inspection certification
●  Final Testing Report
●  RoHs
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