Reliable Hardware Solutions for Every Industry
Comprehensive EMI/RFI shielding, thermal management, grounding, and interconnect performance — all from one source.
What Problems We Solve
We deliver comprehensive hardware solutions that enhance electromagnetic shielding, thermal performance, grounding reliability, and assembly efficiency across modern electronic designs.
- EMI/RFI Interference: Shielding cans, clips, and spring contacts effectively reduce radiated noise and signal crosstalk
- Thermal Management: Stamped heat sinks optimize heat paths while maintaining light weight and low cost.
- High-Frequency Reliability: RF connectors with integrated shielding ensure stable and clean transmission.
- Assembly & Maintenance: Clip-on or frame-and-lid structures allow easy rework and testing.
- Mass Production Consistency: In-house tooling, stamping, and quality control ensure uniform results batch after batch.
Telecommunications:
Aerospace & UAVs:
Smart Wearables:
New Energy:
Medical Electronics:
Automotive Electronics:
Why Choose Hexin
We combine precision engineering, advanced manufacturing, and responsive service to deliver reliable shielding, thermal, and connection solutions for modern electronics.
15+ Years of Industry Expertise
With over 15 years of experience in precision metal stamping, we understand the challenges of EMI shielding, heat dissipation, and electrical connectivity — delivering practical solutions for complex PCB designs.
Integrated Manufacturing Capability
From tooling design and prototyping to mass production and surface finishing, all processes are completed in-house to ensure fast delivery, stable quality, and cost control.
Engineering-Driven Customization
Our professional engineers work closely with customers to optimize material selection, structure design, and assembly compatibility — achieving the perfect balance of performance and manufacturability.
Quality and Reliability You Can Trust
Each part is subject to strict dimensional, plating, and flatness inspections, guaranteeing consistency from prototype to mass production.
